The Aerosol Jet HD2 is optimized for Advanced Semiconductor Packaging including mmWave applications
Optomec is announcing a breakthrough advanced electronics packaging solution to meet the perpetual demand for miniaturization of mobile and wearable products. The Aerosol Jet HD2, uses Optomec's patented Aerosol Jet 3D Electronics Printing solution to produce high resolution circuitry, including a unique ability to dispense conformal 3D interconnects between die, chips, components and substrates. This interconnect approach is all the more powerful due its improved performance at high frequencies, especially for 5G and mmWave applications.
This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20210113005830/en/
Aerosol Jet HD2 for Inline Production. Photo courtesy of Optomec, Inc.
Optomec's Aerosol Jet HD2 targets the existing $4 Billion market for back-end Semiconductor Packaging and Assembly equipment. This includes competing technologies such as wire bonding and dispensing, where shipments average 5,000 – 10,000 machines annually.
The Aerosol Jet solution works by ...
Full story available on Benzinga.com